Specialty Resin
SWT logo ProBlend™ Semiconductor

When it's quality not quantity you're after, there is no better choice than ProBlend™ Semiconductor Grade Resin. This is the perfect polisher, with each lot tested and certified to reach 18 megaohm water when challenged with 10 megaohm water. This is also the choice for laboratory and cartridge applications.

Physical Properties & Characteristics
Functional Structure
    Cation * SO3H+ (hydrogen form sulfonated polystyrene
copolymer)
    Anion * R4N+OH– (hydroxyl form strong base alkyl
quaternary ammonium
polystyrene copolymer)
Physical Form Spherical beads
Ionic Form H/OH
Particle Size Distribution 16 to 45 nominal
    +16 mesh (US Std.) < 5 percent
    –45 mesh (US Std.) < 2 percent
Volume Ration (exhausted)
    Cation * 1.00 parts
    Anion * 1.55 parts
Total Capacity
    Cation * 1.9 meq/mL (Na+ Form)
    Anion * 1.4 meq/mL (Cl– Form)
Column Capacity 13.0 krg/cu.ft. min. to
electrolyte breakthrough
Moisture Content 60% maximum
pH Range 0 to 14
Metals Content as PPM by Weight of Dry Resin (Typ.)
    Iron (Fe) * < 100 ppm
    Copper (Cu) * < 50 ppm
    Lead (Pb) * < 50 ppm
Percent Conversions to Ionic Form
    Cation H+ * 99% minimum
    Anion OH– * 95% minimum
    Cl– * 2% maximum
    CO3–² * 3% maximum
Approx Ship Wt 43 lbs/cu.ft. (720 g/l)
Standard Packaging 7 cu.ft. plastic lined
fiber drums
Maximum Operating Temperature
    Non-regenerable * 100°C
    Regenerable * 60°C
Operating Flow Rate
(Typical)		 2 to 10 gpm/cu.ft.
Effluent Quality Each lot tested and certified to reach less than 50 ppb of TOC in less than 50 BV when challenged with 10 megaohm low TOC influent.

* CAUTION: DO NOT MIX ION EXCHANGE RESINS WITH STRONG OXIDIZING AGENTS. Nitric acid and other strong oxidizing agents can cause explosive reactions when mixed with organic materials such as ion exchange resins.
   

Features:

  • Designed to provide ultra-high purity water
  • Low low conductivity
  • High resistance
  • Excellent regenerable capacities for inorganic and organic ions
 
1169 - ProBlend Semiconductor Pressure Graph
 
PRESSURE DROP — The graph above shows the expected pressure loss per foot of bed depth as a function of flow rate at various temperatures.
 
1169 - ProBlend Semiconductor Backwash Graph
 
BACKWASH — The backwash step is used to separate the components prior to regeneration and to remove particles. The separation is optimized at a bed expansion of 50 to 75 percent.
 

Note: These suggestions and data are based on information we believe to be reliable. However, we do not make any guarantee or warranty. We caution against using these products in any unsafe manner or in violation of any patents. Further, we assume no liability for the consequences of any such actions.
 
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Safe Water Technologies, Inc.
996 Bluff City Boulevard
Elgin, IL 60120 USA
  
 
Telephone: +1.847.888.6900
Facsimile: +1.847.888.6924
E-mail: info@swtwater.com
http://www.swtwater.com

Last Updated: March 5, 2008